Air-cavity package with dual signal-transition sides

ABSTRACT

The present disclosure relates to an air-cavity package, which includes a bottom substrate, a top substrate, a perimeter wall, a bottom electronic component, and a top electronic component. The bottom substrate includes a bottom signal via extending through the bottom substrate and the top substrate includes a top signal via extending through the top substrate. The perimeter wall extends between a periphery of the top substrate and a periphery of the bottom substrate to form a cavity. The bottom electronic component is mounted on the bottom substrate, exposed to the cavity, and electrically coupled to the bottom signal via. The top electronic component is mounted on the top substrate, exposed to the cavity, and electrically coupled to the top signal via.

RELATED APPLICATIONS

This application is a divisional of U.S. patent application Ser. No.15/410,151, filed on Jan. 19, 2017, which claims the benefit ofprovisional patent application Ser. No. 62/381,756, filed on Aug. 31,2016, the disclosures of which are hereby incorporated herein byreference in their entirety.

FIELD OF THE DISCLOSURE

The present disclosure relates to an air-cavity package and a processfor making the same, and more particularly to an air-cavity package withdual signal-transition sides and a process to form the air-cavitypackage to provide dual signal-transition sides.

BACKGROUND

In semiconductor packaging, mold compounds are normally used toencapsulate flip-chip dies and or wire-bonding dies to protect the diesagainst damage from the outside environment. However, direct contact ofthe mold compounds and active die surfaces may adversely impact theelectrical performance of the dies, especially for high frequencydevices. Accordingly, it is desirable to package the dies in aconfiguration that is more appropriate for high frequency performance.

With developed semiconductor fabrication technology and popularity ofportable communication electronic devices, such as cellular phones,tablet computers, and so forth, high levels of integration ofsemiconductor packages are highly desired. Package on package (POP),which stacks two or more semiconductor packages vertically, is asemiconductor packaging technology that allows higher electronicsdensity in final products. POP offers benefits to smallprinted-circuit-board areas, where short trace lengths between differentsemiconductor packages helps enhance device performance. However, forapplications that have space constraints in the z-direction (thickness),POP may not provide an optimal package solution.

Accordingly, there remains a need for improved package designs toincrease the integration level of semiconductor packages and enhance thehigh frequency performance of the semiconductor packages withoutsignificantly increasing the package size.

SUMMARY

The present disclosure relates to an air-cavity package with dualsignal-transition sides and a process for making the same. According toone embodiment, an air-cavity package includes a bottom substrate, a topsubstrate, a perimeter wall, a bottom electronic component, and a topelectronic component. The bottom substrate includes a bottom substratebody having an upper side and a lower side, at least one first bottommetal structure on the upper side of the bottom substrate body, at leastone second bottom metal structure on the lower side of the bottomsubstrate body, and at least one bottom signal via that extends from theupper side of the bottom substrate body through the bottom substratebody to the lower side of the bottom substrate body and is electricallycoupled to the at least one second bottom metal structure. The topsubstrate includes a top substrate body having an upper side and a lowerside, at least one first top metal structure on the upper side of thetop substrate body, at least one second top metal structure on the lowerside of the top substrate body, and at least one top signal via thatextends from the upper side of the top substrate body through the topsubstrate body to the lower side of the top substrate body and iselectrically coupled to the at least one first top metal structure. Theperimeter wall extends from a periphery of the lower side of the topsubstrate body to a periphery of the upper side of the bottom substratebody. As such, a cavity is defined by a portion of the upper side of thebottom substrate body, an inside surface of the perimeter wall, and aportion of the lower side of the top substrate body. The perimeter wallincludes at least one signal via structure that extends from an uppersurface of the perimeter wall through the perimeter wall to a lowersurface of the perimeter wall, and is electrically coupled to the atleast one first bottom metal structure and the at least one second topmetal structure. The bottom electronic component is mounted on the upperside of the bottom substrate body, exposed to the cavity, andelectrically coupled to the at least one bottom signal via. The topelectronic component is mounted on the lower side of the top substratebody, exposed to the cavity, and electrically coupled to the at leastone top signal via.

In one embodiment of the air-cavity package, the bottom substratefurther includes at least one bottom thermally conductive structure thatextends from the upper side of the bottom substrate body through thebottom substrate body to the lower side of the bottom substrate body.The at least one bottom thermally conductive structure is thermallycoupled to the bottom electronic component and conducts heat generatedfrom the bottom electronic component toward the lower side of the bottomsubstrate body.

According to another embodiment, the air-cavity package is included in asystem assembly. Besides the air-cavity package, the system assemblyalso includes a printed circuit board (PCB) and a patch antenna board.Herein, the lower side of the bottom substrate body is over the PCB suchthat the at least one bottom signal via transmits signals between thebottom electronic component and the PCB. The patch antenna board residesover the upper side of the upper substrate body such that the at leastone top signal via transmits signals between the top electroniccomponent and the patch antenna board.

In one embodiment of the system assembly, the PCB includes a heat sinkextending through the PCB such that the at least one bottom thermallyconductive structure is thermally coupled to the heat sink and conductsheat generated from the bottom electronic component to the heat sink.

According to an exemplary process for making an air-cavity package, abottom package precursor including a bottom substrate and a bottomelectronic component is provided. The bottom substrate includes a bottomsubstrate body having an upper side and a lower side, at least one firstbottom metal structure on the upper side of the bottom substrate body,at least one second bottom metal structure on the lower side of thebottom substrate body, and at least one bottom signal via that extendsfrom the upper side of the bottom substrate body through the bottomsubstrate body to the lower side of the bottom substrate body and iselectrically coupled to the at least one second bottom metal structure.The bottom electronic component is mounted on the upper side of thebottom substrate body and electrically coupled to the at least onebottom signal via. Next, a top package precursor including a topsubstrate and a top electronic component is provided. The top substrateincludes a top substrate body having an upper side and a lower side, atleast one first top metal structure on the upper side of the topsubstrate body, at least one second top metal structure on the lowerside of the top substrate body, and at least one top signal via thatextends from the upper side of the top substrate body through the topsubstrate body to the lower side of the top substrate body and iselectrically coupled to the at least one first top metal structure. Thetop electronic component is mounted on the lower side of the topsubstrate body and electrically coupled to the at least one top signalvia. In addition, a perimeter wall including at least one signal viastructure that extends from an upper surface of the perimeter wallthrough the perimeter wall to a lower surface of the perimeter wall isthen provided. Finally, the bottom package precursor, the perimeterwall, and the top package precursor are assembled together. Herein, theperimeter wall extends from a periphery of the lower side of the topsubstrate body to a periphery of the upper side of the bottom substratebody such that a cavity is defined by a portion of the upper side of thebottom substrate body, an inside surface of the perimeter wall, and aportion of the lower side of the top substrate body. The bottomelectronic component and the top electronic component are exposed to thecavity. The at least one signal via structure is electrically coupled tothe at least one first bottom metal structure and the at least onesecond top metal structure.

Those skilled in the art will appreciate the scope of the presentdisclosure and realize additional aspects thereof after reading thefollowing detailed description of the preferred embodiments inassociation with the accompanying drawing figures.

BRIEF DESCRIPTION OF THE DRAWING FIGURES

The accompanying drawing figures incorporated in and forming a part ofthis specification illustrate several aspects of the disclosure, andtogether with the description serve to explain the principles of thedisclosure.

FIG. 1 provides an exemplary air-cavity package according to oneembodiment of the present disclosure.

FIG. 2 provides an exemplary system assembly including the exemplaryair-cavity package shown in FIG. 1.

FIGS. 3A-3C illustrate an exemplary process to form the exemplaryair-cavity package shown in FIG. 1 according to one embodiment of thepresent disclosure.

It will be understood that for clear illustrations, FIGS. 1-3C may notbe drawn to scale.

DETAILED DESCRIPTION

The embodiments set forth below represent the necessary information toenable those skilled in the art to practice the embodiments andillustrate the best mode of practicing the embodiments. Upon reading thefollowing description in light of the accompanying drawing figures,those skilled in the art will understand the concepts of the disclosureand will recognize applications of these concepts not particularlyaddressed herein. It should be understood that these concepts andapplications fall within the scope of the disclosure and theaccompanying claims.

It will be understood that, although the terms first, second, etc. maybe used herein to describe various elements, these elements should notbe limited by these terms. These terms are only used to distinguish oneelement from another. For example, a first element could be termed asecond element, and, similarly, a second element could be termed a firstelement, without departing from the scope of the present disclosure. Asused herein, the term “and/or” includes any and all combinations of oneor more of the associated listed items.

It will be understood that when an element such as a layer, region, orsubstrate is referred to as being “on” or extending “onto” anotherelement, it can be directly on or extend directly onto the other elementor intervening elements may also be present. In contrast, when anelement is referred to as being “directly on” or extending “directlyonto” another element, there are no intervening elements present.Likewise, it will be understood that when an element such as a layer,region, or substrate is referred to as being “over” or extending “over”another element, it can be directly over or extend directly over theother element or intervening elements may also be present. In contrast,when an element is referred to as being “directly over” or extending“directly over” another element, there are no intervening elementspresent. It will also be understood that when an element is referred toas being “connected” or “coupled” to another element, it can be directlyconnected or coupled to the other element or intervening elements may bepresent. In contrast, when an element is referred to as being “directlyconnected” or “directly coupled” to another element, there are nointervening elements present.

Relative terms such as “below” or “above” or “upper” or “lower” or“horizontal” or “vertical” may be used herein to describe a relationshipof one element, layer, or region to another element, layer, or region asillustrated in the Figures. It will be understood that these terms andthose discussed above are intended to encompass different orientationsof the device in addition to the orientation depicted in the Figures.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the disclosure.As used herein, the singular forms “a,” “an,” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. It will be further understood that the terms “comprises,”“comprising,” “includes,” and/or “including” when used herein specifythe presence of stated features, integers, steps, operations, elements,and/or components, but do not preclude the presence or addition of oneor more other features, integers, steps, operations, elements,components, and/or groups thereof.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure belongs. It willbe further understood that terms used herein should be interpreted ashaving a meaning that is consistent with their meaning in the context ofthis specification and the relevant art and will not be interpreted inan idealized or overly formal sense unless expressly so defined herein.

FIG. 1 provides an exemplary air-cavity package 10 according to oneembodiment of the present disclosure. In this embodiment, the air-cavitypackage 10 includes a bottom substrate 12, a top substrate 14, and aperimeter wall 16. In detail, the bottom substrate 12 is a multi-layersubstrate (not shown) and includes a bottom substrate body 18 having anupper side and a lower side, a first bottom metal layer 20 on the upperside of the bottom substrate body 18, a second bottom metal layer 22 onthe lower side of the bottom substrate body 18, a first bottom signalvia 24, a second bottom signal via 26, a bottom slug 28, and a number ofbottom thermal vias 30. For the purpose of this illustration, the firstbottom metal layer 20 includes three separate metal structures: a firstmetal structure 20(A), a second metal structure 20(B), and a third metalstructure 20(C). These metal structures 20(A)-20(C) of the first bottommetal layer 20 may be formed as metal pads and/or traces. The secondbottom metal layer 22 includes four separate metal structures: a firstmetal structure 22(A), a second metal structure 22(B), a third metalstructure 22(C), and a fourth metal structure 22(D). These metalstructures 22(A)-22(D) of the second bottom metal layer 22 may be formedas metal pads and/or traces. In different applications, the first bottommetal layer 20 and the second bottom metal layer 22 may include fewer ormore metal structures.

The first bottom signal via 24 extends from the upper side of the bottomsubstrate body 18 through the bottom substrate body 18 to the lower sideof the bottom substrate body 18 and is electrically coupled to the firstmetal structure 20(A) of the first bottom metal layer 20 and the firstmetal structure 22(A) of the second bottom metal layer 22. The secondbottom signal via 26 extends from the upper side of the bottom substratebody 18 through the bottom substrate body 18 to the lower side of thebottom substrate body 18 and is electrically coupled to the second metalstructure 20(B) of the first bottom metal layer 20 and the third metalstructure 22(C) of the second bottom metal layer 22. In differentapplications, there may be fewer or more bottom signal vias included inthe bottom substrate 12.

Further, the bottom slug 28 and the bottom thermal vias 30 are thermallyconductive structures. The bottom slug 28 may be formed from copper andhave at least 100 W/m·k thermal conductivity. Herein, the bottom slug 28extends from the upper side of the bottom substrate body 18 through thebottom substrate body 18 to the lower side of the bottom substrate body18, and is thermally coupled to the second metal structure 22(B) of thesecond bottom metal layer 22. The bottom thermal vias 30 may be filledwith epoxy or plated by copper. The bottom thermal vias 30 extend fromthe upper side of the bottom substrate body 18 through the bottomsubstrate body 18 to the lower side of the bottom substrate body 18, andare thermally coupled to the fourth metal structure 22(D) of the secondbottom metal layer 22. In different applications, there may be fewer ormore bottom slugs/bottom thermal vias included in the bottom substrate12.

The top substrate 14 is a multi-layer substrate (not shown) and includesa top substrate body 32 having an upper side and a lower side, a firsttop metal layer 34 on the upper side of the top substrate body 32, asecond top metal layer 36 on the lower side of the top substrate body32, a first top signal via 38, a second top signal via 40, and a thirdtop signal via 42. For the purpose of this illustration, the first topmetal layer 34 includes three separate metal structures: a first metalstructure 34(A), a second metal structure 34(B), and a third metalstructure 34(C). These metal structures 34(A)-34(C) of the first topmetal layer 34 may be formed as metal pads and/or traces. The second topmetal layer 36 includes five separate metal structures: a first metalstructure 36(A), a second metal structure 36(B), a third metal structure36(C), a fourth metal structure 36(D), and a fifth metal structure36(E). These metal structures 36(A)-36(E) of the second top metal layer36 may be formed as metal pads and/or traces. In different applications,the second top metal layer 36 may include fewer or more metalstructures.

The first top signal via 38 extends from the upper side of the topsubstrate body 32 through the top substrate body 32 to the lower side ofthe top substrate body 32 and is electrically coupled to the first metalstructure 34(A) of the first top metal layer 34 and the second metalstructure 36(B) of the second top metal layer 36. The second top signalvia 40 extends from the upper side of the top substrate body 32 throughthe top substrate body 32 to the lower side of the top substrate body 32and is electrically coupled to the second metal structure 34(B) of thefirst top metal layer 34 and the third metal structure 36(C) of thesecond top metal layer 36. The third top signal via 42 extends from theupper side of the top substrate body 32 through the top substrate body32 to the lower side of the top substrate body 32 and is electricallycoupled to the third metal structure 34(C) of the first top metal layer34 and the fifth metal structure 36(E) of the second top metal layer 36.In different applications, there may be fewer or more bottom signal viasincluded in the top substrate 14.

The perimeter wall 16 extends from a periphery of the lower side of thetop substrate body 32 to a periphery of the upper side of the bottomsubstrate body 18. As such, a cavity 44 is defined by a portion of theupper side of the bottom substrate body 18, an inside surface of theperimeter wall 16, and a portion of the lower side of the top substratebody 32. The perimeter wall 16 includes two separate via structures: afirst signal via structure 46 and a second signal via structure 48. Thefirst signal via structure 46 extends from an upper surface of theperimeter wall 16 through the perimeter wall 16 to a lower surface ofthe perimeter wall 16, and is electrically coupled to the first metalstructure 20(A) of the first bottom metal layer 20 and the first metalstructure 36(A) of the second top metal layer 36. The second signal viastructure 48 extends from the upper surface of the perimeter wall 16through the perimeter wall 16 to the lower surface of the perimeter wall16, and is electrically coupled to the third metal structure 20(C) ofthe first bottom metal layer 20 and the fifth metal structure 36(E) ofthe second top metal layer 36.

In addition, the air-cavity package 10 also includes a number ofelectronic components mounted on the bottom substrate 12 and the topsubstrate 14. For the purpose of this illustration, the air-cavitypackage 10 includes a bottom surface mounted device (SMD) 50 and abottom wire-bonding die 52 mounted on the upper side of the bottomsubstrate body 18, and a top wire-bonding die 54, a first top SMD 56,and a second top SMD 58 mounted on the lower side of the top substratebody 32. The bottom SMD 50, the bottom wire-bonding die 52, the topwire-bonding die 54, the first top SMD 56, and the second top SMD 58 areexposed to the cavity 44. In different applications, the air-cavitypackage 10 may include fewer or more wire-bonding dies and SMDs.

The bottom SMD 50 includes a bottom SMD body 60 mounted on the upperside of the bottom substrate body 18 via a SMD-attach material 62, andtwo bottom SMD interconnects 64. The bottom SMD interconnects 64 extendoutward from a bottom surface of the bottom SMD body 60, and are coupledto the first metal structure 20(A) and the second metal structure 20(B)of the first bottom metal layer 20. In different applications, thebottom SMD 50 may include more bottom SMD interconnects. Herein, thefirst bottom signal via 24 and the second bottom signal via 26 areelectrically coupled to the bottom SMD 50, and the bottom slug 28 isthermally coupled to the bottom SMD 50. The bottom SMD 50 may be aresistor, capacitor, inductor, or flip-chip die.

The bottom wire-bonding die 52 includes a bottom wire-bonding die body66 mounted on the upper side of the bottom substrate body 18 via adie-attach material 68, and two bottom bonding wires 70. The bottombonding wires 70 extend from a top surface of the bottom wire-bondingdie body 52, and are electrically coupled to the second metal structure20(B) and the third metal structure 20(C) of the first bottom metallayer 20. In different applications, the bottom wire-bonding die 52 mayinclude more bottom bonding wires. Herein, the bottom signal via 26 iselectrically coupled to the bottom wire-bonding die 52 and the bottomthermal vias 30 are thermally coupled to the bottom wire-bonding die 52.

The top wire-bonding die 54 includes a top wire-bonding die body 72mounted on the lower side of the bottom substrate body 32 via thedie-attach material 68, and two top bonding wires 74. The top bondingwires 74 extend from a top surface of the top wire-bonding die body 72and are electrically coupled to the first metal structure 36(A) and thesecond metal structure 36(B) of the second top metal layer 36. Indifferent applications, the top wire-bonding die 54 may include more topbonding wires. In this embodiment, the lower side of the top substratebody 32 may not have a flat surface and may have a recess 76, in whichthe top wire-bonding die 54 is mounted. Herein, the first top signal via38 is electrically coupled to the top wire-bonding die 54.

The first top SMD 56 includes a first top SMD body 78 and two first topSMD interconnects 80. The first top SMD interconnects 80 extend outwardfrom a bottom surface of the first top SMD body 78, and are coupled tothe third metal structure 36(C) and the fourth metal structure 36(D) ofthe second top metal layer 36. In different applications, the first topSMD 56 may include more first top SMD interconnects. Herein, the secondtop signal via 40 is electrically coupled to the first top SMD 56. Thefirst top SMD 56 may be a resistor, capacitor, inductor, or flip-chipdie.

The second top SMD 58 includes a second top SMD body 82 and two secondtop SMD interconnects 84. The second top SMD interconnects 84 extendoutward from a bottom surface of the second top SMD body 82, and arecoupled to the fourth metal structure 36(D) and the fifth metalstructure 36(E) of the second top metal layer 36. In differentapplications, the second top SMD 58 may include more second top SMDinterconnects. Herein, the third top signal via 42 is electricallycoupled to the second top SMD 58. The second top SMD 58 may be aresistor, capacitor, inductor, or flip-chip die.

The air-cavity package 10 may also include a sealing material 86 used toseal off the cavity 44. The sealing material 86 extends about anexterior portion of a top junction, which is formed between the uppersurface of the perimeter wall 16 and the lower side of the top substratebody 32, and an exterior portion of a bottom junction, which is formedbetween the lower surface of the perimeter wall 16 and the upper side ofthe bottom substrate body 18.

FIG. 2 provides an exemplary system assembly 88 including the air-cavitypackage 10 shown in FIG. 1. Besides the air-cavity package 10, thesystem assembly 88 also includes a printed circuit board (PCB) 90 with afirst heat sink 92 and a second heat sink 94 extending through the PCB90, and a patch antenna board 96. The lower side of the bottom substratebody 18 is over the PCB 90, such that the first bottom signal via 24 andthe second bottom signal via 26 are electrically coupled to the PCB 90by the first metal structure 22(A) and the third metal structure 22(C)of the second bottom metal layer 22, respectively. The bottom slug 28 isthermally coupled to the first heat sink 92 of the PCB 90 by the secondmetal structure 22(B) of the second bottom metal layer 22. The bottomthermal vias 30 are thermally coupled to the second heat sink 94 of thePCB 90 by the fourth metal structure 22(D) of the second bottom metallayer 22. In addition, the patch antenna board 96 resides over the upperside of the top substrate body 32, such that the first top signal via38, the second top signal via 40, and the third top signal via 42 areelectrically coupled to the patch antenna board 96 by the first metalstructure 34(A), the second metal structure 34(B), and the third metalstructure 34(C) of the first top metal layer 34, respectively.

Notice that the air-cavity package 10 has dual signal-transition sides:the lower side of the bottom substrate body 18 and the upper side of thetop substrate body 32. The dual signal-transition sides of theair-cavity package 10 may enhance the integration of the air-cavitypackage 10. The first bottom signal via 24 and the second bottom signalvia 26 may be used for signal transitions between the electroniccomponents mounted on the upper side of the bottom substrate body 18(like the bottom SMD 50 and the bottom wire-bonding die 52) and the PCB90. The first top signal via 38, the second top signal via 40, and thethird top signal via 42 may be used for signal transitions between theelectronic components mounted on the lower side of the top substratebody 32 (like the top wire-bonding die 54, the first top SMD 56, and thesecond top SMD 58) and the patch antenna board 96.

In addition, the first signal via structure 46 and the second signal viastructure 48 may be used for signal transitions between the electroniccomponents mounted on the upper side of the bottom substrate body 18(like the bottom SMD 50 and the bottom wire-bonding die 52) and theelectronic components mounted on the lower side of the top substratebody 32 (the top wire-bonding die 54, the first top SMD 56, and thesecond top SMD 58). Herein, the first signal via structure 46 may beelectrically isolated from the second signal via structure 48. Signalsgenerated by the electronic components mounted on the upper side of thebottom substrate body 18 (like the bottom SMD 50 and the bottomwire-bonding die 52) may also be transited to the patch antenna board 96by the second signal via structure 48 and the third top signal via 42.Signals generated by the electronic components mounted on the lower sideof the top substrate body 32 (like the top wire-bonding die 54, thefirst top SMD 56, and the second top SMD 58) may be transited to the PCB90 by the first signal via structure 46 and the first bottom signal via24.

Further, the heat generated from the electronic components mounted onthe upper side of the bottom substrate body 18 (like the bottom SMD 50and the bottom wire-bonding die 52) may be conducted toward the firstand second heat sinks 92 and 94 of the PCB 90 through the bottomthermally conductive structures (like the bottom slug 28 and the bottomthermal vias 30). Herein, each bottom thermally conductive structure(like the bottom slug 28 and the bottom thermal vias 30) is directly ina heat dissipation path and adjacent to an electric component (like thebottom SMD 50 and the bottom wire-bonding die 52). Each signal via (likethe first bottom signal via 24, the second bottom signal via 26, thefirst top signal via 38, the second top signal via 40, or the third topsignal via 42) is not directly in a heat dissipation path.

FIGS. 3A-3C illustrate an exemplary process to form the exemplaryair-cavity package 10 shown in FIG. 1. Although the exemplary process isillustrated as a series of sequential steps, the exemplary process isnot necessarily order dependent. Some operations may be done in adifferent order than that presented. Further, processes within the scopeof this disclosure may include fewer or more operations than thoseillustrated in FIGS. 3A-3C.

Initially, a bottom package precursor 98, a top package precursor 100,and the perimeter wall 16 are provided as depicted in FIG. 3A. Thebottom package precursor 98 includes the bottom substrate 12, the bottomSMD 50, and the bottom wire-bonding die 52. The configurations of thebottom substrate 12, the bottom SMD 50, and the bottom wire-bonding die52 are the same as described above. As such, the bottom SMD body 60 ofthe bottom SMD 50 is mounted on the upper side of the bottom substratebody 18 via the SMD-attach material 62. The bottom SMD interconnects 64of the bottom SMD 50 are coupled to the first metal structure 20(A) andthe second metal structure 20(B) of the bottom substrate 12. Herein, thefirst bottom signal via 24 and the second bottom signal via 26 areelectrically coupled to the bottom SMD 50. The bottom slug 28 isthermally coupled to the bottom SMD 50 and will conduct heat generatedfrom the bottom SMD 50 toward the lower side of the bottom substratebody 18. The bottom wire-bonding die body 66 of the bottom wire-bondingdie 52 is mounted on the upper side of the bottom substrate body 18 viathe die-attach material 68. The bottom bonding wires 70 of the bottomwire-bonding die 52 are electrically coupled to the second metalstructure 20(B) and the third metal structure 20(C) of the bottomsubstrate 12. Herein, the second bottom signal via 26 is electricallycoupled to the bottom wire-bonding die 52. The bottom thermal vias 30are thermally coupled to the bottom wire-bonding die 52 and will conductheat generated from the bottom wire-bonding die 52 toward the lower sideof the bottom substrate body 18.

In addition, the top package precursor 100 includes the top substrate14, the top wire-bonding die 54, the first top SMD 56, and the secondtop SMD 58. The configurations of the top substrate 14, the topwire-bonding die 54, the first top SMD 56, and the second top SMD 58 arethe same as described above. As such, the top wire-bonding die body 72of the top wire-bonding die 54 is mounted on the lower side of the topsubstrate body 32 via the die-attach material 68. The top bonding wires74 of the top wire-bonding die 54 are electrically coupled to the firstmetal structure 36(A) and the second metal structure 36(B) of the topsubstrate 14. Herein, the first top signal via 38 is electricallycoupled to the top wire-bonding die 54. The first top SMD 56 and thesecond top SMD 58 are mounted on the lower side of the top substratebody 32. The first top SMD interconnects 80 of the first top SMD 56 arecoupled to the third metal structure 36(C) and the fourth metalstructure 36(D) of the top substrate 14. The second top SMDinterconnects 84 of the second top SMD 58 are coupled to the fourthmetal structure 36(D) and the fifth metal structure 36(E) of the topsubstrate 14. Herein, the second top signal via 40 is electricallycoupled to the first top SMD 56 and the third top signal via 42 iselectrically coupled to the second top SMD 58.

Next, the bottom package precursor 98, the top package precursor 100,and the perimeter wall 16 are assembled together as depicted in FIG. 3B.The perimeter wall 16 extends from the periphery of the lower side ofthe top substrate body 32 to the periphery of the upper side of thebottom substrate body 18 such that the cavity 44 is defined by a portionof the upper side of the bottom substrate body 18, the inside surface ofthe perimeter wall 16, and a portion of the lower side of the topsubstrate body 32. The bottom SMD 50, the bottom wire-bonding die 52,the top wire-bonding die 54, the first top SMD 56, and the second topSMD 58 are exposed to the cavity 44. The first signal via structure 46of the perimeter wall 16 is electrically coupled to the first metalstructure 20(A) of the bottom substrate 12 and the first metal structure36(A) of the top substrate 14. The second signal via structure 48 of theperimeter wall 16 is electrically coupled to the third metal structure20(C) of the bottom substrate 12 and the fifth metal structure 36(E) ofthe top substrate 14.

Finally, the sealing material 86 is applied to an exterior portion ofthe top junction, which is formed between the upper surface of theperimeter wall 16 and the lower side of the top substrate body 32, andan exterior portion of the bottom junction, which is formed between thelower surface of the perimeter wall 16 and the upper side of the bottomsubstrate body 18 as depicted in FIG. 3C. The cavity 44 is sealed off bythe sealing material 86, and the air-cavity package 10 is formed.

Those skilled in the art will recognize improvements and modificationsto the preferred embodiments of the present disclosure. All suchimprovements and modifications are considered within the scope of theconcepts disclosed herein and the claims that follow.

What is claimed is:
 1. A method comprising: providing a bottom packageprecursor, which comprises a bottom substrate and a bottom electroniccomponent, wherein: the bottom substrate comprises a bottom substratebody having an upper side and a lower side, at least one first bottommetal structure on the upper side of the bottom substrate body, at leastone second bottom metal structure on the lower side of the bottomsubstrate body, and at least one bottom signal via that extends from theupper side of the bottom substrate body through the bottom substratebody to the lower side of the bottom substrate body and is electricallycoupled to the at least one second bottom metal structure; and thebottom electronic component is mounted on the upper side of the bottomsubstrate body and electrically coupled to the at least one bottomsignal via; providing a top package precursor, which comprises a topsubstrate and a top electronic component, wherein: the top substratecomprises a top substrate body having an upper side and a lower side, atleast one first top metal structure on the upper side of the topsubstrate body, at least one second top metal structure on the lowerside of the top substrate body, and at least one top signal via thatextends from the upper side of the top substrate body through the topsubstrate body to the lower side of the top substrate body and iselectrically coupled to the at least one first top metal structure; andthe top electronic component is mounted on the lower side of the topsubstrate body and electrically coupled to the at least one top signalvia; providing a perimeter wall, which comprises at least one signal viastructure extending from an upper surface of the perimeter wall throughthe perimeter wall to a lower surface of the perimeter wall; andassembling the bottom package precursor, the perimeter wall, and the toppackage precursor, wherein: the perimeter wall extends from a peripheryof the lower side of the top substrate body to a periphery of the upperside of the bottom substrate body such that a cavity is defined by aportion of the upper side of the bottom substrate body, an insidesurface of the perimeter wall, and a portion of the lower side of thetop substrate body; the bottom electronic component and the topelectronic component are exposed to the cavity; and the at least onesignal via structure is electrically coupled to the at least one firstbottom metal structure and the at least one second top metal structure.2. The method of claim 1 further comprising applying a sealing materialto an exterior portion of a top junction, which is formed between theupper surface of the perimeter wall and the lower side of the topsubstrate body, and an exterior portion of a bottom junction, which isformed between the lower surface of the perimeter wall and the upperside of the bottom substrate body.
 3. The method of claim 1 wherein thebottom substrate further comprises at least one bottom thermallyconductive structure that extends from the upper side of the bottomsubstrate body through the bottom substrate body to the lower side ofthe bottom substrate body, wherein the at least one bottom thermallyconductive structure is thermally coupled to the bottom electroniccomponent and conducts heat generated from the bottom electroniccomponent toward the lower side of the bottom substrate body.
 4. Themethod of claim 3 wherein the at least one bottom thermally conductivestructure comprises a plurality of thermal vias.
 5. The method of claim3 wherein the at least one bottom thermally conductive structurecomprises a slug.
 6. The method of claim 1 wherein the at least onebottom signal via is electrically coupled to the at least one firstbottom metal structure.
 7. The method of claim 1 wherein the at leastone top signal via is electrically coupled to the at least one secondtop metal structure.
 8. The method of claim 1 wherein the bottomelectronic component is one from a group consisting of a resistor, acapacitor, an inductor, and a flip-chip die.
 9. The method of claim 1wherein the bottom electronic component is a wire-bonding die.
 10. Themethod of claim 1 wherein the top electronic component is one from agroup consisting of a resistor, a capacitor, an inductor, and aflip-chip die.
 11. The method of claim 1 wherein the top electroniccomponent is a wire-bonding die.
 12. The method of claim 1 wherein thebottom substrate is a multi-layer substrate.
 13. The method of claim 1wherein the top substrate is a multi-layer substrate.